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DARPA tackling reusable, modular chipset technology

Discussion in 'Network World' started by RSS, Jul 19, 2016.

  1. RSS

    RSS New Member Member

    Is it possible to develop chip technology that combines the high-performance characteristics of ASICS with the speedy, low-cost features of printed circuit boards?

    Scientists at the Defense Advanced Research Projects Agency this week said they were looking for information on how to build interface standards that would enable modular design and practical circuit blocks that could be reused to greatly shorten electronics development time and cost.

    +More on Network World: ‎DARPA: Researchers develop chip part that could double wireless frequency capacity+

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