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‎DARPA: Researchers develop chip part that could double wireless frequency capacity

Discussion in 'Network World' started by RSS, Apr 19, 2016.

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    A DARPA-funded research team said recently it had developed a tiny component for silicon-based circuitry that could double the radio-frequency (RF) capacity for wireless communications—offering faster web-searching as well as the development of smaller, less expensive and more readily upgraded antenna arrays for radar, signals intelligence, and other applications.

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    The work was led by Columbia University electrical engineers Harish Krishnaswamy and Negar Reiskarimian and funded under DARPA’s Arrays at Commercial Timescales (ACT) program, which is looking to develop wireless electronic components that can be integrated into larger, more advanced systems quickly. DARPA said ACT products aim to “shorten design cycles and in-field updates and push past the traditional barriers that lead to 10-year array development cycles, 20- to 30-year static life cycles and costly service-life extension programs.”

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